Manufacturing of a modern component-laded printed circuit board (PCB) is an amazing fusion and coordination of diverse technologies. There’s the board as substrate itself, the stencils and masks that ...
At APEC 2025, Nexperia announced several important additions to its portfolio of enhancement-mode GaN and SiC devices. Among them is a new series of 1,200-V SIC MOSFETs available in thermally enhanced ...
ABSTRACT: This study applies Principal Component Analysis (PCA) to evaluate and understand academic performance among final-year Civil Engineering students at Mbeya University of Science and ...
Older folks may recall the famous Tektronix 576 and 577 curve tracers from half a century ago. A few of these have survived the decades and ended up in some lucky engineer’s home/work lab. Wow the ...
High power SMD ceramic-based chip resistors are susceptible to solder joint failure, cracking, and pulling the solder lands off the PCB. This is due to the difference in the coefficient of thermal ...
Although the newer process of surface mount technology (SMT) has largely replaced through-hole technology (THT) as a PCB assembly method for high-volume production, THT still has its place in ...
The best high-speed pick-and-place machines for circuit board assembly can place an astonishing 100,000 surface-mount components an hour with an accuracy of ±0.04 millimeter. That’s a lot of chips!
KYOTO, Japan--(BUSINESS WIRE)--Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) has announced its new Parasitic Element Coupling Device. This state-of-the-art solution improves ...
The increasing demand for compact, high-performance and reliable electronic devices requires novel solutions to address the challenges of thermal management, higher component density and signal ...
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