New Memory Chip Survives 1300°F, Hotter Than Lava

Electronics usually fail under extreme heat, but scientists have now created a memory chip that keeps working at temperatures ...
EDN

Advancing AI performance with HBM4, SPHBM4 DRAM solutions

HBM has become one of the most successful and widely adopted examples of chiplet-based integration in AI systems.

AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the ...
GitHub

The highest-scoring AI memory system ever benchmarked. And it's free.

Every conversation you have with an AI — every decision, every debugging session, every architecture debate — disappears when the session ends. Six months of work, gone. You start over every time.
Hosted on MSN

OpenAI solves the stack memory problem

For years, software stacks kept getting more complex. OpenAI is moving in the opposite direction. This video breaks down how AI is collapsing layers that used to be mandatory. The impact affects ...
Reuters

Samsung Electronics says customers praised competitiveness of HBM4 chip

SEOUL, Jan 2 (Reuters) - Samsung Electronics (005930.KS), opens new tab customers have praised the differentiated competitiveness of its next-generation high-bandwidth memory (HBM) chips, or HBM4, ...
IEEE

Evaluating Memory Management and Garbage Collection Algorithms with Virtual Threads in High-Concurrency Java Applications

Abstract: Garbage collection (GC) is a critical memory management mechanism within the Java Virtual Machine (JVM) responsible for automating memory allocation and reclamation. Its performance affects ...
Network World

Micron joins HBM4 race with 36GB 12-high stack, eyes AI and data center dominance

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...