Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.

Texas Instruments (NasdaqGS:TXN) has introduced new isolated power modules that use its proprietary IsoShield packaging ...

Power device manufacturers exhibit their latest advances in topologies, packaging, and solutions at APEC 2026.

Power electronics in the Industry 4.0 era are evolving to deliver higher efficiency and power density and simplify power design.

By embedding digital logic directly into the GaN chiplet, Intel collapses what is typically a small system into a single unit ...

Trinasolar has unveiled its newly upgraded Vertex N G3 module. Leveraging its advanced n-type i-TOPCon Ultra technology, the module now delivers a maximum power output of 760W, setting a new benchmark ...

This March, Electronic Specifier's Associate Editor, Sheryl Miles, takes a look at the top 5 power products released in March ...

Trinasolar has unveiled its newly upgraded Vertex N G3 modules on 25th March. Leveraging its advanced n-type i-TOPCon Ultra technology, the Vertex N G3 modules now deliver a maximum power output of ...

Apple's upcoming iPhone 18 Pro range is tipped to carry forward much of the design language seen in the iPhone 17 Pro series.

Sarcina launches UCIe-A/S Packaging IP, enabling high-performance, scalable chiplet interconnects with reduced ...

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